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INTEGRATED CIRCUITS
DATA SHEET
TDA1516CQ 24 W BTL car radio power amplifier
Product specification File under Integrated Circuits, IC01 July 1994
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
FEATURES * Requires very few external components for Bridge-TiedLoad (BTL) * High output power (without bootstrap) * Low offset voltage at output (important for BTL) * Fixed gain * Good ripple rejection * Mute/stand-by switch * Load dump protection * AC and DC short-circuit-safe to ground and VP * Thermally protected * Reverse polarity safe QUICK REFERENCE DATA SYMBOL VP PARAMETER positive supply voltage range operating non-operating load dump IORM IP Isb Isw ZI TXTAL PO SVRR Vno Vos repetitive peak output current total quiescent current stand-by current switch-on current input impedance BTL crystal temperature output power supply voltage ripple rejection noise output voltage DC output offset voltage THD = 10%; 4 RS = 0; f = 100 Hz f = 1 to 10 kHz 6.0 - - - - - - 25 - - 45 48 - - CONDITIONS MIN. GENERAL DESCRIPTION
TDA1516CQ
* Capability to handle high energy on outputs (VP = 0) * Protected against electrostatic discharge * No switch-on/switch-off plop * Flexible leads * Low thermal resistance * Identical inputs (inverting and non-inverting).
The TDA1516CQ is a monolithic integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package. The device is primarily developed for car radio applications.
TYP. 14.4 - - - 40 0.1 - - - 22 - - 70 -
MAX. 18 30 45 4 80 100 60 - +150 - - - - 100
UNIT V V V A mA A A k C W dB dB V mV
ORDERING INFORMATION EXTENDED TYPE NUMBER TDA1516CQ Note 1. SOT141-6; 1996 August 21. PACKAGE PINS 13 PIN POSITION DIL MATERIAL plastic CODE SOT141(1)
July 1994
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Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
handbook, full pagewidth
bootstrap switch 2 60 k VA 2 k power stage 18 k mute switch
Cm
100
1
5
6
VP
bootstrap switch 11
stand-by switch VA 15 k x1 12 15 k mute reference voltage
stand-by reference voltage
mute switch
TDA1516CQ
18 k power stage 2 k 9 13 60 k 4 input reference voltage mute switch Cm bootstrap switch power ground (substrate) 7
MBC084
VA 8 100
signal ground 3
VP 10
Fig.1 Block diagram.
July 1994
3
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
PINNING SYMBOL -INV1 INV GND1 Vref OUT1 BS1 GND2 BS2 OUT2 VP M/SB RR -INV2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 DESCRIPTION non-inverting input 1 inverting input ground (signal) reference voltage output 1 bootstrap 1 ground (substrate) bootstrap 2 output 2 supply voltage mute/stand-by switch supply voltage ripple rejection non-inverting input 2 FUNCTIONAL DESCRIPTION
TDA1516CQ
The TDA1516CQ contains two identical amplifiers with differential input stages. It can be used for bridge applications. The gain of each amplifier is fixed at 20 dB. A special feature of this device is the mute/stand-by switch, which has the following features: * low stand-by current (< 100 A) * low mute/stand-by switching current (low cost supply switch) * mute condition.
handbook, halfpage
INV1 INV GND1 Vref OUT1 BS1 GND2 BS2 OUT2
1 2 3 4 5 6 7 8 9 TDA1516CQ
VP 10 M/SS 11 RR 12 INV2 13
MLA704
Fig.2 Pin configuration.
July 1994
4
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
LIMITING VALUES In accordance with the Absolute maximum System (IEC 134). SYMBOL VP PARAMETER supply voltage operating non-operating load dump protected; during 50 ms; rise time 2.5 ms VPSC VPR IOSM IORM Ptot Tstg Tvj AC and DC short-circuit safe voltage reverse polarity energy handling capability at outputs non-repetitive peak output current repetitive peak output current total power dissipation storage temperature range virtual junction temperature Tcase < 75 C; (see Fig.3) VP = 0 - - - - - - -55 - - - - CONDITIONS
TDA1516CQ
MIN.
MAX. 18 30 45 18 6 200 6 4 25 +150 +150
UNIT V V V V V mJ A A W C C
Fig.3 Power derating curve.
July 1994
5
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; unless otherwise specified. See note 1. SYMBOL Supply VP IP VO Vos Vsw Vmute VO Vos Vsb Isb Isw IP positive supply voltage range quiescent current DC output voltage DC output offset voltage (pins 5 and 9) note 3 note 2 6.0 - - - PARAMETER CONDITIONS MIN.
TDA1516CQ
TYP.
MAX.
UNIT
14.4 40 6.8 - - - - - - - - 25 5.5
18 80 - 100 - 6.4 2 100
V mA V mV
Mute/stand-by switch switch-on voltage level 8.5 V
MUTE CONDITION mute voltage output signal in mute position DC output offset voltage (pins 5 and 9) VI = 1 V (max); f = 20 Hz to10 kHz - 0 V11 0.5 V 0.5 < V11 2 V switch-on current supply current V11 V10; note 4 short-circuit to GND; note 5 - - - - mV STAND-BY CONDITION stand-by voltage DC standby current 2 100 500 60 - V A A A mA 3.3 - V mV
July 1994
6
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
AC CHARACTERISTICS VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; unless otherwise specified. See note 1. SYMBOL PO PARAMETER output power CONDITIONS THD = 0.5% THD = 10% THD = 10%; note 6 VP = 13.2 V; THD = 0.5% VP = 13.2 V; THD = 10% VP = 13.2 V; THD = 10%; note 6 THD B flow fhigh Gv SVRR total harmonic distortion power bandwidth low frequency roll-off high frequency roll-off closed loop voltage gain supply voltage ripple rejection ON; notes 8 and 9 ON; notes 8 and 10 MUTE; notes 8 to 10 stand-by; notes 8 to 10 ZI Vno input impedance noise output voltage ON; RS = 0; note 11 RS = 10 k; note 12 MUTE; note 12 Notes 1. All characteristics are measured using the circuit shown in Fig.4 2. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V 3. At 18 V < V < 30 V, the DC output voltage VP/2 4. If V11 > V10, then I11 must be 10 mA - - - 70 100 60 45 48 48 80 25 - - - - 30 PO = 1 W THD = 0.5%; PO = -1 dB with respect to 15 W -3 dB; note 7 -1 dB - 20 25 - - MIN. 15 20 21 - - -
TDA1516CQ
TYP. 17 22 24 13.5 17 19 0.05 20 to 15 000 25 - 26
MAX. - - - - - - - - - - 27 - - - - 38 - 200 -
UNIT W W W W W W % Hz Hz kHz dB dB dB dB dB k V V V
5. Conditions: V11 = 0; short-circuit output to GND; switch V11 to mute or on condition (rise time V11 > 10 s) 6. With bootstrap and a resistor of 100 k from VP/2 to the positive supply voltage (VP). (Bootstrap capacitor of 47 F) 7. Frequency response externally fixed 8. Ripple rejection measured at the output with a source-impedance of 0 (max. ripple amplitude of 2 V) 9. Frequency = 100 Hz 10. Frequency = 1 to 10 kHz 11. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz 12. Noise output voltage independent of RS (Vin = 0)
July 1994
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Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
stand - by switch
handbook, full pagewidth
VP 4 input reference voltage 2 12 11 10 100 nF 2200 F
internal 1/2 V P
TDA1516CQ
1 to pin 13 3 signal ground 7 power ground 6 to V P R =4 L 5 9 8
MBC085
60 k
20 dB
20 dB
60 k
13
220 nF input 2
to pin 2
to V P
Fig.4 Application diagram.
July 1994
8
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
TDA1516CQ
SOT141-6
non-concave x D Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c vM
1 Z e e1 bp wM
13 m e2
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 3.4 e1 1.7 e2 5.08 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT141-6 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-03-11 97-12-16
July 1994
9
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1516CQ
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994
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